First HSPA+ 20 Mbps Call Made by Qualcomm

Qualcomm has completed the world’s first data call using High-Speed Packet
Access Plus (HSPA+) network technology.  The call achieved a data transfer
rate of more than 20 Mbps in a 5 MHz channel.  HSPA+ will allow operators
to double the data and triple the voice capacity of their networks compared to
current HSPA deployments.  The successful data throughput was achieved on
Qualcomm’s MDM8200(TM) product, the
industry’s first chipset solution for HSPA+. 

The latest evolution of WCDMA technology, HSPA+ Release 7, will offer downlink
data transfer rates of up to 28 Mbps and uplink rates of up to 11 Mbps. 
Future HSPA+ releases are expected to support downlink peak rates of 42-84 Mbps
and uplink peak rates of 23 Mbps by using a variety of advanced techniques,
including multiple carriers for transferring data.  HSPA+ is backward
compatible with prior generations of WCDMA and does not require new spectrum
for deployment.  Operators can leverage their existing network and
spectrum resources to offer next-generation wireless bandwidth and performance.